Thermally Conductive Electrically Insulating Potting Compound

This product is designed for applications where thermal management is a concern.

Thermally conductive electrically insulating potting compound.

500 f thermally insulating potting compound. Thermal conductive electrically insulative epoxy cures at room temperature. 50 2366fr is a thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure.

5108 is a self leveling material that exhibits low shrinkage once cured and can withstand high temperatures and high humidity or wet environments. Durapot 866 is a 500ºf thermally and electrically insulating compound. 50 2366fr polyurethane resin system is formulated for applications requiring low exotherm low shrinkage and excellent electrical properties. Forms a low density non porous foam for high temp applications.

832tc potting and encapsulating compound is a thermally conductive black two part epoxy that offers extreme environmental mechanical and physical protection for printed circuit boards and electronic assemblies. Outstanding heat dissipative properties. Flexible low viscosity thermally conductive epoxy. Nasa approved for low outgassing.

Available in flame retardant grades. Convenient two part room temp curing system. Meets nasa low outgassing specifications.