Thermally Conductive Electrically Insulating Adhesive

Flexible low viscosity thermally conductive epoxy.

Thermally conductive electrically insulating adhesive.

Technical product bulletin thermally conductive electrically insulating compound product description. A replacement to heat cure adhesives. 50 3170 is a high performance thermally conductive epoxy rubber formulation designed for those applications requiring excellent electrical insulation and low stress during cure. Our aluminum filled system is widely used for the assembly of both fin bonded and folded fin heat sinks as well as cooling plates.

Meets nasa low outgassing specifications. Bond ply is available in a psa or laminating format. Serviceable from 60 f to 250 f. A silver filled electrically conductive low outgassing epoxy appli tec s 5200 is specifically designed to cure with low shrinkage at room temperature or cure quickly at elevated temperatures the material is ideal for applications such as electrical bonding emi shielding and room temperature soldering.

Bond ply provides for the decoupling of bonded materials with mismatched thermal coefficients of expansion. Thermally conductive electrically insulating low thermal expansion adhesive epoxy adhesive thermo bond 110 is flame retardant and is designed to meet the rigid requirement of ul 94 v0. Formulated to draw heat away from sensitive electronic components these potting compounds have higher thermal conductivity than standard potting compounds. The bond ply family of materials are thermally conductive and electrically isolating.

Good thermal conductivity 1 0 1 4 w m k low cl ion content and outgassing. Use them to encase electronic assemblies for protection from dust chemicals moisture mechanical shock and vibration. 3m thermally conductive epoxy adhesive tc 2810 is a thermally conductive 2 part epoxy using boron nitride bn filler for good thermal conductivity with high adhesion. 5200 exhibits a high thermal conductivity of 2 5w mk and a low volume resistivity of 0.

A replacement to screw mounting. Outstanding heat dissipative properties. Thermo bond 110 is flame retardant and is designed to meet the rigid requirement of ul 94 v0. Rigid and wear resistant epoxies are the strongest of the potting compounds.

Thermally conductive electrically insulating low thermal expansion adhesive epoxy adhesive. Thermal conductive electrically insulative epoxy cures at room temperature. Aa bond 2153 is a thixotropic smooth paste thermal conductive epoxy system that passes the nasa outgassing specification. Aa bond 2153 thermally conductive electrically insulating compound 2 part thixtropic.